Epoxy Base Electronic Material Co Ltd - Class A

1
SHSE:603002 (China)   Class A
Â¥ 5.75 (+1.41%) Dec 27
110.58
P/B:
1.90
Market Cap:
Â¥ 6.44B ($ 882.48M)
Enterprise V:
Â¥ 5.15B ($ 705.21M)
Volume:
30.04M
Avg Vol (2M):
57.49M
Trade In:
Volume:
30.04M
Avg Vol (2M):
57.49M

Business Description

Description
Epoxy Base Electronic Material Co Ltd is engaged in the production of electronic grade epoxy resins. The solutions offered by the company include general series, diluted type series, casting and APG series, and solution series.
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Performance

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Epoxy Base Electronic Material Co Ltd Executives

Details

Valuation Chart

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Analyst Estimate

Key Statistics

Name Value
Revenue (TTM) (Mil ¥) 2,150.669
EPS (TTM) (Â¥) 0.052
Beta 1.22
Volatility % 39.75
14-Day RSI 45.29
14-Day ATR (Â¥) 0.326121
20-Day SMA (Â¥) 6.217
12-1 Month Momentum % -7.51
52-Week Range (Â¥) 3.57 - 7.37
Shares Outstanding (Mil) 1,134.08

Piotroski F-Score Details

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Component Result
Piotroski F-Score 5
Positive ROA
Positive CFROA
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CFROA > ROA
Lower Leverage yoy
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Epoxy Base Electronic Material Co Ltd Filings

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Epoxy Base Electronic Material Co Ltd Stock Events

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Epoxy Base Electronic Material Co Ltd Frequently Asked Questions

What is Epoxy Base Electronic Material Co Ltd(SHSE:603002)'s stock price today?
The current price of SHSE:603002 is ¥5.75. The 52 week high of SHSE:603002 is ¥7.37 and 52 week low is ¥3.57.
When is next earnings date of Epoxy Base Electronic Material Co Ltd(SHSE:603002)?
The next earnings date of Epoxy Base Electronic Material Co Ltd(SHSE:603002) is .
Does Epoxy Base Electronic Material Co Ltd(SHSE:603002) pay dividends? If so, how much?
The  Dividend Yield %  of Epoxy Base Electronic Material Co Ltd(SHSE:603002) is 0.88% (As of Today), Highest Dividend Payout Ratio of Epoxy Base Electronic Material Co Ltd(SHSE:603002) was 2.22. The lowest was 0.18. And the median was 0.56. The  Forward Dividend Yield % of Epoxy Base Electronic Material Co Ltd(SHSE:603002) is 0.88%. For more information regarding to dividend, please check our Dividend Page.

Press Release

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