Analyst Ming-Chi Kuo from Tianfeng International Securities reports that Apple (AAPL, Financial) will delay the mass production of its HomePod with a screen until the third quarter of next year due to software development issues. The estimated shipment for the latter half of next year is around 500,000 units. Should the market response be positive, annual shipments may reach millions. BYD Electronics, the exclusive assembler, and Tianma Microelectronics, the sole panel supplier, are set to benefit from this venture. The HomePod will reportedly feature an A18 processor, a 6-7 inch screen, and support Apple Intelligence.
Tianma Microelectronics, expected to gain significantly as Apple's new panel supplier, forecasts growth due to a projected 2% to 4% rise in China's smartphone market next year and its increasing OLED market share. This partnership marks BYD Electronics' second major assembly order from Apple after the iPad.
